SUSS MicroTek MA6/BA6 Mask Aligner

MA/BA6 mask aligner is designed for all standard lithography applications and wafer sizes of up to 150 mm. For thick-resist MEMS applications, the MA/BA6 offers high resolution and optimum edge quality. The bottom side alignment option allows for pattern printing on both sides of the substrate. The MA/BA6 additionally provides tailored features for fragile III-V compounds, thinned or warped wafers, transparent substrates and pieces or single dies. [Product Link]

RRID:SCR_020533

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