Facility Details

Electron microscopy and analysis (SEM, TEM, FIB, EBSD, WDS), microelectronic device fabrication (7000 sq ft cleanroom, Class 100-1000), X-ray computed tomography (CT), particle system characterization (size, zeta potential, surface area, porosity, rheology), X-ray diffraction, surface analysis (AFM, profilometry, XPS, Auger), spectroscopy (UV/Vis with integrating sphere, FTIR/NIR with micro capability and micro-Raman).