Arizona State University

Contact Info:

Michael Marrs

https://cores.research.asu.edu/aep

Grants and Identifiers:

RRID: RRID:SCR_028600

Instrumentation:

Services Provided:

Relevant Publications:

Description:

Facility provides comprehensive electronics fabrication and packaging capabilities bridging the high risk, resource-intensive gap between innovation and product development in an information-secure environment. AEP offers backplane electronics design, device fabrication, fanout wafer level packaging, electrical device test and integration capabilities, and operates dedicated pilot line toolsets for technology development. Assists with thin film processing, thin film characterization, device packaging and characterization, photolithography, etching, and flexible electronics. AEP is capable of processing 2 wafers all the way up to 300 mm round wafers.Services include microelectronic device prototyping and packaging, wafer coating or cleaning, wafer metrology, and pilot scale product demonstration. AEP is equipped with the tools and expertise to help take your electronic device from prototype fabrication to final packaging.